LOCTITE® ABLESTIK 84-1LMISR4 provides the following product：
技术：环氧
外观：银
固化：热固化
pH ：6.0
产品好处●导电●箱烤箱治疗●用量极小
应用：芯片粘接
84-1LMISR4导电芯片粘接粘合剂已制定用于高通量，自动化模具附加设备。84-1LMISR4粘合剂的流变学允许最小的粘合剂分配和模具停留时间，没有尾矿或串线问题。独特的粘接特性组合使这种材料成为半导体工业中应用最广泛的模具附着材料之一。
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm)
5.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm
8,000
Work Life @ 25°C, Physical worklife by % filler, hours
18
Shelf Life @ -40°C (from date of manufacture), days
365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 175°C
Alternate Cure Schedule
3 to 5 minute ramp to 175°C + 1 hour @ 175°C
Glass Transition Temperature, TMA penetration, °C
120
Coefficient of Thermal Expansion, TMA expansion:
Below Tg, ppm/°C
40
Above Tg, ppm/°C
150
Thermal Conductivity @ 121ºC, C-matic Conductance
Tester, W/(m-K)
2.5
Tensile Modulus, DMTA :
@ -65°C
N/mm² 4,400
(psi) (640,000)
@ 25 °C
N/mm² 3,900
(psi) (570,000)
@ 150 °C
N/mm² 2,000
(psi) (290,000)
@ 250 °C
N/mm² 300
(psi) (44,000)
